NEW YORK, Oct. 23, 2015 (GLOBE NEWSWIRE) — ITG Investment Research today announced that it has initiated research coverage of the semiconductor industry. Employing a unique data driven approach to investment research, ITG now offers empirical insights into the supply and business-to-business operations of semiconductor manufacturers and semiconductor equipment companies.
“This expansion in our TMT [Telecom, Media & Technology] coverage addresses a critical market segment,” said Michael Marrale, Managing Director and Head of Research, Sales & Trading at ITG. “Investors in semiconductor manufacturers now have vital intelligence on a piece of the supply chain catering to computing and networking equipment makers, mobile device manufacturers, and storage businesses.”
ITG Investment Research Senior Analyst Mark Bachman launched his coverage with initiation reports on Applied Materials (AMAT), SanDisk (SNDK), KLA-Tencor (KLAC), Micron Technology (MU), and Lam Research (LRCX). Bachman has fifteen years of experience covering the space with a focus on devices, capital equipment, foundries, and components. He began his career at Intel and has held research positions at Thomas Weisel Partners, Pacific Crest, Auriga USA and Avian Securities.
In addition to TMT, ITG Investment Research provides proprietary research on over 300 companies across Consumer, Energy, and the Macro Economy. For more information about ITG Investment Research, please contact firstname.lastname@example.org or call the New York sales desk at 212-444-6100.
ITG (NYSE:ITG) is an independent execution broker and research provider that partners with global portfolio managers and traders to provide unique data-driven insights throughout the investment process. From investment decision through settlement, ITG helps clients understand market trends, improve performance, mitigate risk and navigate increasingly complex markets. ITG is headquartered in New York with offices in North America, Europe, and Asia Pacific. For more information, please visit www.itg.com.
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