ALBANY, New York, Oct. 13, 2017 (GLOBE NEWSWIRE) — The global electrostatic discharge (ESD) foam packaging market is expected to impress with a substantial rise in demand due to the swift surge in the miniaturization of electronic devices. Moreover, there is a rise in the demand for mobility in devices around the globe, which could augur well for the ESD Foam Packaging market. The adoption of smaller, lightweight devices could be greatly augmented with the demand for mobility.
Furthermore, the popularity of smaller electronics in the automotive and telecommunication industries could translate into a hefty demand for the miniaturization of semiconductor integrated circuits (ICs) as well. The advantage of ESD foam packaging over other products in the neutralization of tribocharging in densely-built, smaller semiconductor ICs and printed circuit boards (PCBs) could promote the market growth.
The global ESD foam packaging market, according to Transparency Market Research (TMR), is foretold to touch a revenue collection of US$233.8 mn by the end of 2022, advancing from a valuation of US$172.5 mn achieved in 2017. During the forecast period 2017–2022, the market could expand at a 6.3% CAGR.
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Global ESD Foam Packaging Market: Major Insights
The international ESD foam packaging market is envisaged to ride its growth on powerful and lasting trends such as the emergence of smart cities. Nations around the world could consider developing smart cities at a quicker pace by integrating multitudinous IT solutions. The development of solutions for the growth of smart cities announced by major companies such as Cisco could add to the demand for ESD foam packaging. The use of public physical infrastructure via data analytics and artificial intelligence (AI) and improvement of the intelligence of cities could be crucial factors for improving the market growth.
The international ESD foam packaging market is prognosticated to be segregated as per application into two segments, i.e. electrical and electronic component and others. Amongst these, the market for electrical and electronic component could bag a larger share in the coming years. By 2022, it is anticipated to secure a share of 93.1%. In view of material and additive, the market could be divided into conductive and dissipative polymer, metal, and additive. In terms of type of end-use industry, the market is predicted to see a classification into aerospace, manufacturing, defense and military, automobile, electrical and electronics, and others.
On the basis of geography, the international ESD foam packaging market is prophesied to be segmented into different regions and a country, i.e. Japan. However, Asia Pacific except Japan (APEJ) could top the market with respect to share in the foreseeable future. It is envisioned to expand at a 5.8% CAGR. North America and Europe could be other prominent regions of the market offering ample of growth opportunities to industry players. Japan and the Middle East and Africa (MEA) are foreseen to display discouraging figures in the latter forecast years.
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Global ESD Foam Packaging Market: Vendor Landscape
The worldwide ESD foam packaging market is projected to witness the presence of notable players such as Statclean Technology (S) Pte Ltd., Electrotek Static Controls Pvt. Ltd., Helios Packaging, Conductive Containers, Inc., Botron Company, Inc., GWP Group Limited, Elcom U.K. Ltd., Tekins Limited, and Nefab AB.
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