Global 3D TSV Market Will Reach USD 36.50 Billion by 2024: Zion Market Research

According to the report, global 3D TSV market was valued USD 2.49 billion in 2017 and is expected to reach around USD 36.50 billion by 2024, growing at a CAGR of 46.78% for the forecast period from 2018 to 2024.

New York, NY, Oct. 11, 2018 (GLOBE NEWSWIRE) — Zion Market Research has published a new report titled “Global 3D TSV Market  by Product (Memory, MEMS, CMOS Image Sensors, Imaging and Optoelectronics, Advanced LED Packaging, and Others) and by End-Users (Consumer Electronics Sector, Information and Communication Technology Sector, Automotive Sector, Military, Aerospace and Defense, and Other Sectors): Global Industry Perspective, Comprehensive Analysis, and Forecast, 2017 – 2024”. According to the report, global 3D TSV market was valued USD 2.49 billion in 2017 and is expected to reach around USD 36.50 billion by 2024, growing at a CAGR of 46.78% for the forecast period from 2018 to 2024. 

3D TSV or through silicon via technology is one of the important technology used in the semiconductor industry. Through silicon via is an electrical connection passed vertically through a stacked silicon wafer or die. 3D TSV is the replacement for the 2D packaging technologies such as wire-bond and flip chips. Through Silicon Via (TSV) interconnects are used in a wide range of 2.5D and 3D packaging applications and architectures which requires very high performance and functionality at the lowest energy or performance metric. 3D TSV technology is significantly being used in improving the logic function and memory of the electronics, non-memory, and CMOS such as tablet PCs, smartphones, and televisions, among others.

Browse through 29 Tables & 28 Figures spread over 119 Pages and in-depth TOC on “Global 3D TSV Market: By Type, Technology, Trends, Size, Market Share, Segments Analysis and Forecast to 2017 – 2024”.

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Increasing demand for high aspect ratio, minimum power consumption, and compact size chip architectures are driving the market of 3D TSV. Further, factors such as the robust outlook for the information & communication technologies, rapid increase in the cloud-based applications, and continuous development in the smart lighting sectors and DRAM are further increasing the adoption of 3D TSV technology for packaging solutions. Additionally, increasing demand for improved architecture in electronic products coupled with the growing trend of miniaturization of electronic devices is driving the global 3D TSV market. However, the thermal issues caused by higher levels of integration are restraining the growth of the 3D TSV market.

The market for 3D TSV is segmented into product, end-users, and region. On the basis of product, the global 3D TSV market is categorized into memory, MEMS, CMOS image sensors, imaging and optoelectronics, and advanced LED packaging, and others. Based on end-users, the global 3D TSV market is divided into the consumer electronics sector, information, and communication technology sector, automotive sector, military, aerospace and defense, and other sectors. All the segments are analyzed based on present and future trends and the market is projected from 2018 to 2024. Based on regions, the 3D TSV market is segmented into North America, Asia Pacific, Europe, Latin America, and the Middle East and Africa with its further categorization into the US, the UK, Germany, France, China, India, Japan, and Brazil.

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Asia Pacific emerged as the largest region for the global 3D TSV market and it accounted for the highest market share of total revenue generated in 2017. The major factors driving the market are the presence of prominent market players like Samsung Electronics, Toshiba Corporation, Taiwan Semiconductor Manufacturing companies, etc. in this region. The rapid increase in the number of cell phone users and demand for new memory technology has resulted in the high adoption of 3D ICs which use TSV technology. These are the factors leading to the growth of 3D TSV market. The countries such as China, Taiwan, Japan, and South Korea have registered high levels of manufacturing in the consumer electronics, automotive, and transportation sectors, thus increasing the demand for 3D TSV market.

North America and Europe 3D TSV markets are mainly driven by increasing research & development activities undertaken for the development of advanced technology-based designs for 3D integrated circuits. Further, the emerging trend of 3D packaging using through silicon via technology in North America and the European semiconductor industry is being driven by the need for improving performance and to reduce timing delays. Furthermore, the high demand for TSV technology for functional integration requirement coupled with assembly and wafer fabrication by the semiconductor industries is propelling the growth of 3D TSV market. European companies continue to be at the frontline of 3D TSV technology as some of the research and development organizations such as Imec, Fraunhofer-IZM, and CEA-LETI are among the top companies to develop the state-of-the-art technology. Moreover, on the foundry and IDM side, STMicroelectronics was one of the first organizations worldwide to manufacture CIS with via last process realization. Similarly, with the help of appropriate toolset, ams AG developed a highly innovative TSV architecture for a demanding medical image sensor solution.

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The developing economies in Latin America also have the potential for 3D TSV market growth. Rising middle-class population in the region and growing demand for consumer and commercial electronics are some of the factors driving the growth of this market. Further, Brazil is the leading market in computers, consumer electronics, cell phones, and surpasses. Other BRIC regions have also registered increased consumption of consumer electronics. In addition, more than USD 5 billion in chips are imported by Brazil and Argentina imports more than USD 1 billion to satisfy national demand. This is one of the factors which help in the growth of the 3D TSV market in this region.

Browse the full “Global 3D TSV Market  by Product (Memory, MEMS, CMOS Image Sensors, Imaging and Optoelectronics, Advanced LED Packaging, and Others) and by End-Users (Consumer Electronics Sector, Information and Communication Technology Sector, Automotive Sector, Military, Aerospace and Defense, and Other Sectors): Global Industry Perspective, Comprehensive Analysis, and Forecast, 2017 – 2024” report at https://www.zionmarketresearch.com/report/3d-tsv-market

The Middle East and Africa anticipate being one of the fastest growing regional markets for the 3D TSV market in the forecast period. UAE is expected to be the most lucrative market for 3D TSV in the Middle East. Africa region is also expected to show moderate growth in years to come for 3D TSV market.

The prominent players of 3D TSV market include Intel Corporation, Samsung Electronics Co. Ltd., Toshiba Corp., Amkor Technology, Pure Storage Inc., Broadcom Ltd., Advanced Semiconductor Engineering Inc., Taiwan Semiconductor Manufacturing Company Limited, United Microelectronics Corp., STMicroelectronics NV, and Jiangsu Changing Electronics Technology Co. Ltd.

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The 3D TSV market is segmented as follows:

Global 3D TSV Market: Product Segment Analysis

  • Memory
  • MEMS
  • CMOS Image Sensors
  • Imaging and Optoelectronics
  • Advanced LED Packaging
  • Others

Global 3D TSV Market: End-User Segment Analysis

  • Consumer Electronics Sector
  • Information and Communication Technology Sector
  • Automotive Sector
  • Military, Aerospace and Defence
  • Other Sectors

Global 3D TSV Market: Regional Segment Analysis

  • North America
    • The U.S.
  • Europe
    • UK
    • France
    • Germany
  • Asia Pacific
    • China
    • Japan
    • India
  • Latin America
    • Brazil
  • The Middle East and Africa

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